Academy of Innovative Semiconductor and Sustainable Manufacturing Program on Semiconductor Packaging and Testing 111 Spring

The information regarding to the Graduation/Credit Requirements is only for reference.Please update your information and refer the inquiry the department's officer

Graduation Requirements

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Credit Requirements

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  • Compulsory and includes English teaching total / approximate: {{ graduation_credit_rules.required_course_total }} credit
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Catogory Course Name (Chinese) Course Name (English) Course Language Designated Dept/Inst (Chinese) Designated Dept/Inst (English) Required/ Elective Credits
graduate 薄膜工程 THIN FILM ENGINEERING English 材料所 Materials Science and Engineering elective 3
graduate 高分子結晶特論 SPECIAL TOPIC ON POLYMER CRYSTALLIZATION English 材料所 Materials Science and Engineering elective 3
graduate 半導體工程 SEMICONDUCTOR ENGINEERING English 材料所 Materials Science and Engineering elective 3
graduate 固態熱力學 SOLID STATE THERMODYNAMICS English 材料所 Materials Science and Engineering elective 3
graduate 工業4.1:零缺陷的智慧製造 INDUSTRY 4.1:INTELLIGENT MANUFACTURING WITH ZERO DEFECTS English 製造所 Manufacturing Information and Systems elective 3
graduate 高等材料分析 ADVANCED CHARACTERIZATION OF MATERIALS English 材料所 Materials Science and Engineering elective 3
graduate 高等固態物理(一) ADVANCED SOLID STATE PHYSICS (1) English 材料所 Materials Science and Engineering elective 3
graduate 排程理論與應用 SCHEDULING THEORY AND APPLICATION English 製造所 Manufacturing Information and Systems elective 3
graduate 材料動力學 KINETICS OF MATERIALS English 材料所 Materials Science and Engineering elective 3

Contact Info

1. Applicants from non-English speaking countries are required to provide English proficiency certificate (such as TOEFL, TOEIC or IELTS.) 2. The English proficiency certificate is not required for applicants whose previous degree is from an English-speaking country (Australia, Canada, United Kingdom, Ireland, New Zealand, South Africa or the United States of America) but the applicants have to provide their diplomas as proof.